What you will do
For Nexperia Package and Assembly :
Responsible to identify new type of package and assembly concepts, platforms, materials, processes for Nexperia with a long term view
Technology Intelligence : capturetechnologyinformationandgenerateinsightsbyscouting, technicalmarketanalysisandbenchmarking
Analyze technology and applicationtrends to derive innovative developmentproposals and IP
Maintain and expand global network to Universities, Institutes , Suppliers.
Interfacing to Nexperias global R&D communityandproductioncenters, representsNexperia Packagingin technical forums
What you will need
University degree (MSc, PhD will be an advantage) in Semiconductor Packaging, Materials Technology, Chemistry, Electronics Engineering orsimilar
At least 3 years in Research or Industrial R&D environment for Semiconductor Device Packaging
Architecturalthinking and technicalleadership, ability to connect different technologies
Fluent Business English
Excellentcommunicationskillsandteamplayerwithin global, interculturalenvironment. Provenability to build an externalnetwork
Energetic, result and business / customerorientatedSubject Matter Expert
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia® is a registered trademark.
Nexperia is an Equal Opportunity / Affirmative Action Employer.