Principal Engineer Semiconductor Package Research
Hong Kong

What you will do

For Nexperia Package and Assembly :

  • Responsible to identify new type of package and assembly concepts, platforms, materials, processes for Nexperia with a long term view
  • Technology Intelligence : capturetechnologyinformationandgenerateinsightsbyscouting, technicalmarketanalysisandbenchmarking
  • Analyze technology and applicationtrends to derive innovative developmentproposals and IP
  • Maintain and expand global network to Universities, Institutes , Suppliers.
  • Interfacing to Nexperias global R&D communityandproductioncenters, representsNexperia Packagingin technical forums
  • What you will need

  • University degree (MSc, PhD will be an advantage) in Semiconductor Packaging, Materials Technology, Chemistry, Electronics Engineering orsimilar
  • At least 3 years in Research or Industrial R&D environment for Semiconductor Device Packaging
  • Architecturalthinking and technicalleadership, ability to connect different technologies
  • Fluent Business English
  • Excellentcommunicationskillsandteamplayerwithin global, interculturalenvironment. Provenability to build an externalnetwork
  • Selfdrivenandpathfindingattitude
  • Energetic, result and business / customerorientatedSubject Matter Expert
  • Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia® is a registered trademark.

    Nexperia is an Equal Opportunity / Affirmative Action Employer.


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