Principal Engineer (Modelling)
Hong Kong

About the role

As part of the Package R&D Team in Hong Kong.

What you will do

  • Provide thermal & mechanical stress simulation or / and electrical simulation to support design optimization and risk assessment for package development
  • Develop predictive finite element models of different packages (MOSFETs, Discrete and logic) during assembly processes and testing conditions
  • Manager simulation knowledge database and drive re-use database for risk assessment & recommendation to enable timely decision on package design, material selection, and process flow optimization
  • Provide technical advice to the requestors for the simulation result. Applicable for all products / packages
  • Setup simulation reuse database by simulation correlation to experimental data
  • Work with cross-functional team such as design / material engineers, process engineers
  • Participate R&D projects and other joint project with other parties
  • What you will need

  • M.S. or Ph.D. in Mechanical Engineering, Materials Engineering or related discipline
  • Solid knowledge through academic coursework and work experience in thermal & mechanical multi-physics modeling (linear and non-linear, static and dynamic analysis) and characterization methods (non-linear deformation, viscous behavior, etc.)
  • A deep understand of thermal & mechanical stress physics and familiarity with commercial FEM tools such as ANSYS, and ABAQUS.
  • Prior hand-on experience in the above tools is preferred

  • Experience in semiconductor fabrication flows and knowledge of state-of-the-art technologies, like Discrete, logic and MOSFETs is preferred
  • Ability to effectively work in a multi-functional team environment and collaborate with other engineers to define and implement numerical and experiments for feasibility and validation of concepts and solutions to support new package development
  • Strong verbal and written communication skills is a necessity
  • Experience in electrical simulation is a plus
  • Experience required :
  • At least 5 years’ experience in modeling
  • At least 3 years of experience in semiconductor industry
  • About the team

    When you join our company, you join our team. TeamNexperia, an 11,000+ strong international network that both supports and challenges you to grow.

    We listen to each other and work together with enthusiasm, energy and encouragement to get things done efficiently. Constantly pushing the boundaries, we collaborate with our customers, partners and local communities to meet ever-increasing expectations regardless of the challenges we face.

    Priding ourselves on going the extra mile to achieve world-class results. And valuing the passion, professionalism and perseverance each one of us brings, to make Nexperia the Efficiency Company.


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