Senior Packaging Engineer
Hong Kong

What you will do

  • 1 New wafer & finish product packing method / footprint / carrier tape / box design
  • a) Identify gaps between design requirements and supplier capability timely

    b) Identify technical risk and provide mitigation proposal at the right time with the use of proper design tools : Design FMEA, simulations

    c) Drive for sound solutions

  • 2 Owner of wafer & finish good packing method / footprint / carrier tape / box design process
  • a) Ensure the process is effectively implemented across the whole development life cycle

  • 3 Maintain the footprint / carrier tape / box design rule that correctly reflect the assembly and supplier capabilities
  • 4 Address customers’ physical issues (e.g. T&R, SMT, solderability, packing, etc.) in using our packages
  • 5 Lead local / global package application related projects
  • What you will need

  • Degree in engineering disciplines or materials science, Master degree or higher is preferred
  • Solid knowledge in packing / footprint design / tape-and-reel process and materials / carton box design
  • Experience with AutoCAD / Solidworks is a must
  • Good command of written and spoken English
  • Good interpersonal and presentation skills in cross-site and cross-functional team
  • Strong customer focus, proactive and able to work with minimal supervision
  • 5 years in manufacturing / design environment. Experience in semiconductor industry is an advantage
  • Experience in handling customer is an advantage
  • Willing to travel in occasion
  • Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia® is a registered trademark.

    Nexperia is an Equal Opportunity / Affirmative Action Employer.


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