Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets.
The Interconnect Technologies business unit serves the printed circuit board, electronic finishing and industrial finishing.
Now our Research and Development Department at the Interconnect Technologies business unit at Fanling, Hong Kong has an opening of Senior Scientist.
The incumbent will provide innovative plating solution to fulfill the rapidly advancing technology needs for electronic devices.
About DowDuPont :
DowDuPont (NYSE : DWDP) is a holding company comprised of The Dow Chemical Company and DuPont with the intent to form strong, independent, publicly traded companies in agriculture, materials science and specialty products sectors that will lead their respective industries through productive, science-
based innovation to meet the needs of customers and help solve global challenges. For more information, please visit us at .
The positions represented by this job posting are aligned to one of the three divisions, Agriculture, Materials Science or Specialty Products, which are expected to separate from DowDuPont into stand-
alone public companies in late 2018 or early 2019. Information on the division alignment will be provided during the recruitment process.